Methods for dicing wafer stacks to provide access to interior structures

ABSTRACT

Methods for dicing water stacks are provided. Preferably, the method includes the steps of: (1) providing a wafer stack having a first wafer and a second wafer; (2) exposing a portion of the first wafer by removing a portion of the second wafer; and (3) dicing the exposed portion of the first wafer such that a first die assembly is at least partially separated from the wafer stack. Wafer stacks and die assemblies also are provided.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to semiconductor fabrication.More specifically, the present invention relates to systems and methodspertaining to wafer stacks that involve dicing the wafer stacks in orderto provide access to interior structures and/or components of the waferstacks.

2. Description of the Related Art

Several semi-conductor device fabrication techniques involve the use ofmultiple semi-conductor wafers that are bonded to each other to form awafer stack. In one such technique, for example, components and/orcircuitry (“processing”) is provided on the upper surface of a firstwafer and on the upper surface of a second wafer. The first wafer isthen inverted and aligned with the second wafer so that correspondingprocessing of the wafers are aligned with each other. The wafers areengaged with each other and bonded together so that the correspondingprocessing properly engage each other. For example, the engagedprocessing may electrically communicate and/or mechanically engage, eachother. FIGS. 1 and 2 schematically depict this technique.

In FIG. 1, representative portions of a first wafer 102 and a secondwater 104 are depicted. Wafer 102 is configured to provide multipledies, e.g., die 106 and die 108. Likewise, wafer 104 is configured toprovide multiple dies, e.g., die 110 and die 112. Each die canincorporate one or more features and/or components that are configuredto engage one or more corresponding features and/or components of a dieof the other wafer. For example, component 116 is configured to engagecomponent 118, component 120 is configured to engage component 122,component 124 is configured to engage component 126, and component 128is configured to engage component 130. Also depicted in FIG. 1 are pads132 and 134, which are provided so as to facilitate communication ofsignals on and off of the wafers. In order to facilitate communicationof signals using the pads, vias 136 and 138 are provided in wafer 102.

In FIG. 2, wafers 102 and 104 are shown bonded together to form a waferstack 200. Wafers 102 and 104 typically are bonded together by aConventional technique, such as thermal compression, eutectic, and/oranodic bonding. As shown in FIG. 2, once the wafers are bonded together,the processing of the wafers generally are disposed between substrates202 and 204 of the wafers. Note that via 138 is aligned with pad 132,and via 136 is aligned with pad 134.

In order to separate die assemblies from the wafer stack, variousthrough-cuts typically are made through the stack. As used herein, a“through-cut” refers to dicing of a portion of the wafer stack so as toseparate the wafer stack at the dicing location. A representativethrough-cut T_(Y2) is depicted in FIG. 3. Also depicted in FIG. 3 arevarious other cut locations that are designated for receivingthrough-cuts. These locations are designated T_(Y1), T_(X1), and T_(X2).As is known, a through-cut is a cut made through the material of thestack that enables the stack to be separated at the cut location. Thus,through-cut T_(Y2) may be cut through the stack from one side to theother side or may be cut through a sufficient depth of the material sothat the stack can be separated, such as by fracturing the materialremaining at the cut location.

By dicing a wafer stack in the manner depicted in FIG. 3, separate dieassemblies, such as die assemblies 402 and 404 (FIG. 4) can be provided.Also depicted in, FIG. 4 is a typical configuration for providingsignals on and/or off the die assembly. More specifically, atransmission medium (represented by an arrow) can be arranged throughthe via so that communication, e.g., electrical communication, opticalcommunication, etc., may be facilitated between a pad of the dieassembly and components external to the die assembly. However, due todesign, manufacturing, performance, and/or assembly considerations,among others, providing one or more vias in a wafer stack and/or dieassembly may not be desirable. Therefore, there is a need for improvedsystems and methods that address these and/or, other shortcomings of theprior art.

SUMMARY OF THE INVENTION

Briefly described, the present invention relates to semiconductorfabrication. In this regard, embodiments of the invention may beconstrued as providing methods for dicing wafer stacks. In a preferredembodiment, the method includes the steps of: (1) providing a waferstack having a first wafer and a second wafer, (2) exposing a portion ofthe first wafer by removing a portion of the second wafer; and (3)dicing the exposed portion of the first wafer such that a first dieassembly is at least partially separated from the wafer stack.

Other embodiments of the invention may be construed as providing dieassemblies. In a preferred embodiment such a die assembly can be formedby the aforementioned method.

Still other embodiments of the invention may be construed as providingwafer stacks that define a plurality of die assemblies. A preferredwafer stack incorporates a first wafer that includes a first component,and a second wafer. The second wafer is arranged in an overlyingrelationship with the first wafer and is bonded to the first wafer. Thesecond wafer defines a recessed portion. Preferably, the first componentof the first wafer is arranged adjacent to the second wafer. Therecessed portion is arranged in an overlying relationship with the firstcomponent and is configured to enable a partial through-cut of thesecond wafer to be performed in a vicinity of the recessed portionwithout significantly damaging the first component.

In another embodiment, the wafer stack includes a first wafer and asecond wafer arranged in an overlying relationship with and bonded tothe first wafer. The first wafer includes a first component, which isarranged adjacent to the second wafer. Preferably, the first and secondwafers are configured to provide a gap that is arranged in an overlyingrelationship with the first component. The gap is configured to enable apartial through-cut of the second wafer in a vicinity of the gap so thatthe first component is not significantly damaged during formation of thepartial through-cut.

Other systems, methods, features, and advantages of the presentinvention will be or become apparent to one with skill in the art uponexamination of the following drawings and detailed description. It isintended that all such additional systems, methods, features, andadvantages be included within this description, be within the scope ofthe present invention, and be protected by the accompanying claims

DESCRIPTION OF THE DRAWINGS

The invention can be better understood with reference to the followingdrawings. The elements of the drawings are not necessarily to scalerelative to each other, emphasis instead being placed upon clearlyillustrating the principles of the invention. Furthermore, likereference numerals designate corresponding parts throughout the severalviews.

FIG. 1 is a schematic view of representative wafers that may be utilizedto form a prior art wafer stack.

FIG. 2 is a schematic diagram depicting a representative prior art waferstack formed from the wafers of FIG. 1.

FIG. 3 is a schematic diagram depicting a representative prior artwafer-stack dicing technique.

FIG. 4 is a schematic diagram depicting representative prior art dieassemblies provided by the dicing technique of FIG. 3.

FIG. 5 is a schematic diagram of representative wafers incorporating apreferred embodiment of the dicing feature of the present invention.

FIG. 6 is a schematic diagram depicting a wafer stack formed from thewafers of FIG. 5.

FIG. 7 is a schematic diagram of the wafer stack of FIG. 6 showing aportion of a preferred dicing technique of the present invention.

FIG. 8 is a schematic diagram depicting the wafer stack of FIG. 7showing a subsequent portion of the dicing technique.

FIG. 9 is a schematic diagram depicting the wafer stack of FIG. 8showing die assemblies resulting from the dicing technique.

FIG. 10 is a schematic diagram depicting a representative portion of awafer stack showing another dicing technique of the invention.

FIG. 11 is a schematic diagram depicting a representative portion of awafer stack showing detail of still another dicing technique of theinvention.

FIG. 12 is a schematic diagram of a representative wafer stack showingdetail of yet another dicing technique of the invention.

FIG. 13 is a schematic diagram depicting a representative portion of adie assembly produced by a dicing technique of the invention.

FIG. 14 is a schematic diagram depicting another representative portionof a die assembly produced by a dicing technique of the invention.

FIG. 15 is a schematic diagram depicting still another representativeportion of a die assembly produced by a dicing technique of theinvention.

DETAILED DESCRIPTION OF THE INVENTION

Referring now to FIG. 5, representative portions of a first wafer 502and a second wafer 504 are depicted. Each of the wafers is configured toprovide one or more dies after a dicing procedure has been performedupon the wafers. In particular, wafer 502 includes dies 506 and 508, andwafer 504 includes dies 510 and 512. Each of the dies of the first waferis adapted to engage a corresponding die of the second wafer. Inparticular, die 508 is adapted to engage die 510, and die 506 is adaptedto engage die 512.

In FIG. 5, each of the wafers includes one or more features and/orcomponents that are configured to engage one or more features and/orcomponents of the other wafer. More specifically, die 506 includescomponents 514 and 516 die 508 includes components 518 and 520 die 510includes components 522, 524 and 526, and die 512 includes components528, 530, and 532. Components 526 and 528 can be configured tofacilitate communication of signals to and/or from their respectivedies.

In the embodiment of FIG,. 5, wafer 502 defines a dicing street; i.e., aportion of the wafer that is configured to accommodate a partialthrough-cut of the wafer stack. As used herein, a “partial through-cut”refers to removing a portion of the material of the wafer stack withoutseparating the wafer stack at the dicing location. Preferably, such apartial through-cut can be accomplished without damaging adjacent wafercomponents and/or material. In this regard, the dicing street of FIG. 5is configured as a recessed portion 540. In other embodiments, thedicing street can be configured as a gap, which is defined by one ormore recessed portions of one or more of the wafers of the wafer stack.The recessed portion(s) of such a gap cooperate to provide adequatespacing for facilitating a partial through-cut.

Removal of material to form a recessed portion may be accomplished by asuitable dicing or cutting procedure. For example, the recessed portioncan be formed by a dicing blade, laser, and/or by aggressive etching.

As depicted in FIG. 6, the various components of wafer 502 are adaptedto engage, and preferably electrically communicate with correspondingcomponents of wafer 504. In particular when wafer 502 is inverted,aligned with, and then engaged by wafer 504, component 520 engagescomponent 522, component 518 engages component 524, component 516engages component 530, and component 514 engages component 532. Soengaged, wafers 502 and 504 form a wafer stack 600, with the variouscomponents of the wafers being at least partially disposed between thebulk 503, i.e., the non component carrying portion, of wafer 502 and thebulk 505 of wafer 504. Also note that recess 540 is arranged in agenerally overlying relationship with components 526 and 528.

In FIG. 6, recess 540 is defined, at least partially, by surface 602.When wafers 502 and 504 are appropriately mated; surface 602 preferablyis adequately spaced from components 526 and 528 to permit removal of atleast a portion of the material of water 502 associated with surface602. In particular, at least a portion of the material can be removed bya dicing procedure, for example. The material to be removed is referredto herein as a “bridge,” e.g., bridge 604.

In the embodiment depicted in FIG. 6, bridge 604 is formed primarily ofbulk 503. In other embodiments, one or more material layers, components,and/or portions of layers and/or components may be included in thebridge.

A preferred dicing procedure or method of the present invention isdepicted sequentially in FIGS. 7-9. In FIG. 7, dicing locations PY1 andPY2 are identified. These locations represent areas where bridge 604 isto be severed from the material of wafer 502. Removal of material alonglocations PY1 and PY2 may be accomplished by a suitable dicing orcutting procedure. For example, the locations can be diced by a dicingblade, laser, and/or aggressively etched so as to remove enough materialto enable separation of the bridge from the wafer stack.

It should be noted that recessed portion 540 facilitates dicing of thematerial of bridge 604 and/or adjacent material of wafer 502 whilepermitting material removal to potentially be accomplished withoutdamaging underlying materials and/or components. For example, surface602 of the recessed portion may be sufficiently spaced from components526 and 528 to permit penetration of a dicing blade (not shown) throughthe material of the bridge to a depth that enables separation of thebridge from the surrounding material. This can be accomplished whilealso providing a sufficient spacing between the blade and thecomponents, e.g., components 526 and 528, so as not to damage thecomponents.

After appropriate dicing, bridge 604 preferably is removed. Thereafter,such as depicted in FIG. 8, a through-cut may be made at dicing locationTY1. Through-cut TY1 separates die assembly 902 from die assembly 904(FIG. 9). So provided, components of a wafer stack, such as components526 and 528, for example, can be accessed to facilitate communication ofsignals on and off the die assemblies. Representative transmission mediaare depicted schematically by arrows. Note that the configuration of thecomponents 526 and 528 after dicing potentially provides increaseddesign flexibility as greater access to these components is providedcompared to die assembly configurations using vias, for example.

As depicted schematically in FIG. 10, multiple die assemblies can beprovided or a wafer stack 1000, e.g., die assemblies 1004, 1006, 1008,1010, 1012, and 1014. In FIG. 10, partial through-cuts PY1 and PY2facilitate removal of a bridge 1002 that is associated with the dieassemblies. Preferably, bridge 1002 is removed prior to performingthrough-cut TY1. Removal of the bridge exposes components of the dieassemblies, such as components 1016 and 1018 of die assemblies 1004 and1006, respectively, as well as exposing through-cut location TY1.Through-cut TY1 separates a first column 1020 of the die assemblies froma second column 1022. Through-cuts TX1 and TX2 also are associated withmultiple die assemblies. In particular, through-cut TX1 separates dieassembly 1008 from die assembly 1012 as well as die assembly 1010 fromdie assembly 1014, and through-cut TX2 separates die assembly 1004 fromdie assembly 1008 as well as die assembly 1006 from die assembly 1010.

Clearly, dicing methods of the present invention may be applied tovarious die configurations. For example, a representative wafer stack1100 (FIG. 11) includes a die assembly 1102. Die assembly 1102incorporates multiple components, e.g., pads 1104, 1106, 1108, 1110,1112, 1114, 1116, and 1118. The components are arranged on opposingsides of the die assembly and are to be exposed by dicing. In order toseparate die assembly 1102 from the wafer stack, partial through-cutsPY1 and PY2 can be used to remove a first bridge (not shown) arranged inthe vicinity of PY1 and PY2, and partial through-cuts PY3 and PY4 can beused to remove a second bridge (not shown) arranged in the vicinity ofPY3 and PY4. Through-cuts TY1 and TY2 then can be used to separate thecolumn 1120 of die assemblies in which the die assembly 1102 isarranged. Thereafter, through-cuts TX1 and TX2 can be used to separatedie assembly 1102 from other die assemblies of that column. It should benoted that the various partial through-cuts and through-cuts can be madein an order other than that described so as to separate the die assemblyfrom the wafer stack.

In FIG. 12, an alternative dicing method is schematically depicted. Themethod in FIG. 12 may be suitable for use in separating a die assemblyfrom a wafer stack where components are to be exposed about theperiphery of the die assembly. In particular, FIG. 12 depicts a waferstack 1200 that includes a die assembly 1202. Die assembly 1202incorporates multiple pads, e.g., pads 1204-1238, about the periphery ofthe die assembly. In order to separate die assembly 1202 from waferstack 1200, partial through-cuts PY1 through PY4 and PX1 through PX4 aremade in order to remove the various material bridges (not shown) that atleast partially obstruct access to the pads. Once so removed,through-cuts TY1, TY2, TX1 and TX2 can be provided. As mentionedhereinbefore, the various partial through-cuts and through-cuts in this,or any other representative example depicted and/or described herein,can be made in an order other than that depicted and/or described so asto separate a die assembly from a wafer stack.

The dicing methodology of the invention also can be applied to a dieassembly that includes more than two wafers. For example, a die assembly1300 incorporating three wafers, e.g., wafers 1302, 1304 and 1306, isdepicted in FIG. 13. In die assembly 1300, a component 1308 is exposedby partially through-cutting wafer 1302 (PY1). A through-cut TY1 then ismade through wafers 1304 and 1306 to separate the die assembly fromother material of an associated wafer stack.

In FIG. 14, a multi-wafer die assembly 1400 is depicted. In thisembodiment, however, component 1402 is provided on the bottommost wafer1404. Thus, in order to expose component 1402, a partial through-cut PY1is made through the material of wafers 1406 and 1408. A through-cut TY1then is made through wafer 1402 to separate die assembly 1400 from othermaterial of an associated wafer stack.

In FIG. 15, a multi-wafer die assembly 1500 is depicted. In thisembodiment, a component 1502 is provided on wafer 1504 and a component1506 is provided on wafer 1508. In order to expose component 1502, apartial through-cut PY1 is made through the material of wafer 15010.This, in turn, enables a partial through-cut PY2 to be made through thematerial of wafer 1504. The combination of the first and second partialthrough-cuts permit through-cut TY1 to separate the die assembly.Various other configurations also may be utilized.

The foregoing description has been presented for purposes ofillustration, and description. It is not intended to be exhaustive or tolimit the invention to the precise forms disclosed. Modifications orvariations are possible in light of the above teachings. The embodimentor embodiments discussed, however, were chosen and described to providethe best illustration of the principles of the invention and itspractical application to thereby enable one of ordinary skill in the artto utilize the invention in various embodiments and with variousmodifications as are suited to the particular use contemplated.

For example, the various partial through-cuts and through-cuts in thisor any other representative example depicted an/or described herein canbe made in an order other than that depicted and/or described so as toseparate a die assembly from a wafer stack. Additionally, variousconfigurations of wafer stacks, die assemblies, dies, components andfeatures can benefit from the methodologies of the present invention.All such modifications and variations, are within the scope of theinvention as determined by the appended claims when, interpreted inaccordance with the breadth to which they are fairly and legallyentitled.

1.-12. (canceled)
 13. The wafer stack of claim 22, wherein said firstcomponent is configured to enable communication of said first dieassembly with a component external to said first die assembly.
 14. Thewafer stack of claim 21, wherein said third wafer defines a recessedportion, said recessed portion of said third wafer being arranged in anoverlying relationship with said second component, said recessed portionof said third wafer being configured to enable a partial through-cut ofsaid third wafer in a vicinity of said recessed portion of said thirdwafer such that said second component is not damaged during formation ofthe partial through-cut of said third wafer.
 15. The wafer stack ofclaim 21, wherein said third wafer comprises means for enabling apartial through-cut of said third wafer.
 16. The wafer stack of claim22, wherein said first component is configured to enable electricalcommunication of said first die assembly with a component external tosaid first die assembly.
 17. The wafer stack of claim 15, wherein saidmeans for enabling a partial through-cut comprises means for preventingdamage of said second component.
 18. A wafer stack defining a pluralityof die assemblies, said wafer stack comprising: a first wafer includinga first component; a second wafer arranged in an overlying relationshipwith said first wafer, said second wafer being bonded to said firstwafer, said first component being arranged adjacent to said secondwafer; and a third wafer, the second wafer being arranged at leastpartially between the first wafer and the third wafer, said first waferand said second wafer defining a gap therebetween, said gap beingarranged in an overlying relationship with said first component, saidgap being configured to enable a partial through-cut of said secondwafer in a vicinity of said gap such that said first component is notdamaged during formation of the partial through-cut; wherein a first dieassembly of the plurality of die assemblies is defined by at least aportion of said first wafer and at least a portion of said second wafer.19. The wafer stack of claim 18, wherein said gap is at least partiallydefined by a recessed portion of said second wafer.
 20. The wafer stackof claim 18, wherein said second wafer has a second component, saidthird wafer defining a recessed portion arranged in an overlyingrelationship with said second component, said recessed portion of saidthird wafer being configured to enable a partial through-cut of saidthird wafer in a vicinity of said recessed portion of said third wafersuch that said second component is not damaged during formation of thepartial through-cut of said third wafer.
 21. A wafer stack defining aplurality of die assemblies, said wafer stack comprising: a first waferhaving a first portion supporting a first component and a second portionsupporting a second component; a second wafer arranged in an overlyingrelationship with the first wafer, the first component and the secondcomponent being located between the first wafer and the second wafer;and a third wafer, the second wafer being arranged at least partiallybetween the first wafer and the third wafer; the wafer stack beingconfigured such that the first portion and the second portion of thefirst wafer are exposed after a portion of each of the second wafer andthe third wafer has been removed.
 22. The wafer stack of claim 21,wherein the wafer stack is further configured such that, after dicingthe first wafer between the first component and the second component toform a first die assembly and a second die assembly of the plurality ofdie assemblies, the first die assembly comprises the first portion ofsaid first wafer that extends outwardly beyond a periphery of a firstportion of the second wafer such that the first component is not locatedbetween the first wafer and the second wafer.
 23. The wafer stack ofclaim 22, wherein the wafer stack is further configured such that, afterdicing the first wafer between the first component and the secondcomponent to form the first die assembly and the second die assembly,the second die assembly comprises the second portion of the first waferthat extends outwardly beyond a periphery of a second portion of saidsecond wafer such that the second component is not located between thefirst wafer and the second wafer.
 24. The wafer stack of claim 21,wherein the second wafer defines a recessed portion, the recessedportion being arranged in an overlying relationship with the firstcomponent, the recessed portion being configured to enable a partialthrough-cut of the second wafer in a vicinity of the recessed portionsuch that the first component is not damaged during formation of thepartial through-cut.
 25. The wafer stack of claim 22, wherein said firstcomponent is configured to enable communication of said first dieassembly with a component external to said first die assembly.
 26. Thewafer stack of claim 25, wherein said first component is configured toenable electrical communication of said first die assembly with acomponent external to said first die assembly.
 27. The wafer stack ofclaim 21, wherein the second wafer includes a third component, andwherein the third wafer defines a recessed portion, the recessed portionof said third wafer being arranged in an overlying relationship with thethird component, the recessed portion of the third wafer beingconfigured to enable a partial through-cut of the third wafer in avicinity of the recessed portion of the third wafer such that the thirdcomponent is not damaged during formation of the partial through-cut ofthe third wafer.
 28. The wafer stack of claim 21, wherein said secondwafer has a second component, and wherein said third wafer comprisesmeans for enabling a partial through-cut of said third wafer.
 29. Thewafer stack of claim 18, wherein said first component is configured toenable communication of said first die assembly with a componentexternal to said first die assembly.
 30. The wafer stack of claim 29,wherein said first component is configured to enable electricalcommunication of said first die assembly with a component external tosaid first die assembly.
 31. A wafer stack defining a plurality of dieassemblies, said wafer stack comprising: a first wafer supporting afirst component; a second wafer arranged in an overlying relationshipwith and bonded to the first wafer; and a third wafer arranged in anoverlying relationship with and bonded to the second wafer, the secondwafer being located at least partially between the first wafer and thethird wafer; the first wafer and the second wafer defining a gaptherebetween, the gap being located adjacent to the first component, thegap being configured to enable a partial through-cut of the second waferand the third wafer in a vicinity of the gap such that the firstcomponent is not damaged during formation of the partial through-cut,wherein a first die assembly of the plurality of die assemblies isdefined by a portion of each of the first wafer, the second wafer andthe third wafer.
 32. The wafer stack of claim 31, wherein the gap isdefined, at least in part, by a recess of the second wafer.